All projects

01 / RF systems

915 MHz RF
Receiver Front End

902–928 MHz RF front end with a band-pass filter, ADL5523 LNA, and differential outputs on a four-layer PCB.

Status: circuit simulation and PCB layout complete. Hardware validation pending.

KiCad 3D render of the completed RF receiver PCB layout
902–928 MHzIntended operating band
4 layersTop-layer RF routing over a ground reference
50 ΩSingle-ended RF input reference
100 ΩDifferential output reference in simulation

Overview

Designed a 902–928 MHz receiver front end with band-pass filtering, low-noise amplification, and complementary outputs for a differential input.

Scope includes circuit simulation, impedance matching, vendor-model evaluation, schematic capture, footprint selection, and four-layer PCB layout. The ADC and downconversion stage are external.

01 / RF INPUT50 Ω SMA input
02 / FILTERCoupled-resonator band-pass filter
03 / GAINADL5523 LNA and matching
04 / OUTPUTLC balun and two SMA outputs

RF Circuit Design

LC Balun

Compared ideal and vendor LC balun models against a target of less than 0.5 dB amplitude imbalance. Adjusting the capacitors from 2.5 pF to 2.4 pF improved the modeled output balance.

LC balun schematic from the original project report. Click to enlarge.

LNA Stability & Matching

The initial amplifier model was conditionally stable. Added damping improved simulated stability at the cost of gain. S-parameter analysis determined the target source and load impedances for the matching networks.

Replaced ideal components with Coilcraft and Murata models to evaluate loss and parasitic effects.

ADL5523 amplifier stage with matching, biasing, and damping components. Click to enlarge.

Band-Pass Filter

Designed capacitively coupled LC resonators around 915 MHz with a 100 MHz bandwidth target. Retuned resonator capacitances after vendor models shifted the response and increased loss.

Three-resonator band-pass filter implemented in the RF signal chain. Click to enlarge.

PCB Layout

Selected a four-layer, 1.6 mm construction with both inner layers assigned to ground for continuous RF return paths.

PCB layer assignments
LayerUse
F.CuRF components, RF routing, and adjacent ground copper
In1.CuMain RF ground reference
In2.CuGround reference for bottom-layer routing
B.CuDC power routing and ground copper

Grounded coplanar waveguide geometry uses a 0.3058 mm trace width and 0.20 mm ground gap for the selected stackup. Final impedance depends on manufactured geometry.

Routed PCB layout, including ground copper and stitching vias. Click to enlarge.

Placed matching components near the amplifier, added ground vias at shunt components, and stitched ground along sensitive RF connections. Similar balun branch lengths limit additional phase imbalance.

Output routing: Out_A is 10.6344 mm and Out_B is 10.4597 mm in the layout, a difference of approximately 0.175 mm.

Simulation Results

Combined-circuit simulations evaluate gain, output phase and amplitude balance, and impedance matching. The simulated −3 dB bandwidth is approximately 102.5 MHz, spanning 867 to 969.5 MHz.

Combined-circuit simulation results. Click to enlarge.

Planned Verification

Planned hardware checks cover input matching, frequency response, gain, output balance, and power behavior. ADC integration requires checking input frequency, drive level, common-mode voltage, and output conditioning.

Project Report

The 25-page report documents simulations, component selection, matching calculations, schematics, stackup, and PCB layout.